Vivo X Fold S foldable smartphone uncovered with Snapdragon 8+ Gen 1 SoC


A few manufacturers are presently engaged on new-generation foldable smartphones. We now have the Samsung Galaxy Z Fold 4, Galaxy Flip 4 and Xiaomi MIX Fold 2 all attributable to arrive this month. Whereas the Samsung Galaxy Z Fold 4 is about to launch on August tenth, there is no such thing as a official launch date for the Xiaomi MIX Fold 2. Now, there are studies {that a} new foldable smartphone from Vivo can be coming. Based on well-liked Weibo tech blogger @DCS, Vivo’s second dual-screen ultrasonic fingerprint foldable smartphone is already on the best way. This machine will include a facet bodily fingerprint resolution. As well as, the upcoming foldable smartphone from Vivo will likely be known as the Vivo X Fold S.

Vivo X Fold S foldable smartphone

That is fairly a fancy title with two standalone letters. Moreover, this new machine will use a Qualcomm Snapdragon 8+ Gen 1 chip. In fact, the improve on this machine shouldn’t be a easy change of chip. As well as, in accordance with earlier studies, Vivo may even launch a vertical folding smartphone.

Vivo X Fold foldable smartphone

In April of this 12 months, the Vivo X Fold foldable smartphone was launched. This machine comes with twin inside and exterior 120Hz E5 screens. This machine additionally makes use of a Qualcomm Snapdragon 8 Gen 1 flagship chip, and adopts the unique design of “sq. and sky”. It additionally comes with aerospace-grade floating wing hinges in addition to dual-screen fingerprints.

Vivo X Fold S

The interior display of Vivo X Fold is an 8.03-inch super-sensing folding big display, with E5 luminous materials. The show makes use of Samsung’s diamond association and helps 2K + decision and a 120Hz refresh price. This machine additionally helps a superconducting anti-reflective coating with self-developed LTPO-based adaptive refresh for debugging.

On the similar time, Vivo X Fold has the world’s first inside and exterior twin 120Hz E5 display. This machine has a big sound cavity three-dimensional symmetrical dual-raiser and an impartial Hello-Fi chip.